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Computational Aerothermodynamic Assessment of Space Shuttle Orbiter Tile Damage: Open Cavities

机译:航天飞机轨道瓦损坏的计算空气热力学评估:空洞

摘要

Computational aerothermodynamic simulations of Orbiter windside tile damage in flight were performed in support of the Space Shuttle Return-to-Flight effort. The simulations were performed for both hypervelocity flight and low-enthalpy wind tunnel conditions and contributed to the Return-to-Flight program by providing information to support a variety of damage scenario analyses. Computations at flight conditions were performed at or very near the peak heating trajectory point for multiple damage scenarios involving damage windside acreage reaction cured glass (RCG) coated silica tile(s). The cavities formed by the missing tile examined in this study were relatively short leading to flow features which indicated open cavity behavior. Results of the computations indicated elevated heating bump factor levels predicted for flight over the predictions for wind tunnel conditions. The peak heating bump factors, defined as the local heating to a reference value upstream of the cavity, on the cavity floor for flight simulation were 67% larger than the peak wind tunnel simulation value. On the downstream face of the cavity the flight simulation values were 60% larger than the wind tunnel simulation values. On the outer mold line (OML) downstream of the cavity, the flight values are about 20% larger than the wind tunnel simulation values. The higher heating bump factors observed in the flight simulations were due to the larger driving potential in terms of energy entering the cavity for the flight simulations. This is evidenced by the larger rate of increase in the total enthalpy through the boundary layer prior to the cavity for the flight simulation.
机译:为支持航天飞机的“重返飞行”工作,对飞行中的轨道器风向瓦片进行了空气动力学仿真计算。对超高速飞行和低焓风洞条件均进行了仿真,并通过提供信息来支持各种损害情景分析,从而为“返航计划”做出了贡献。在飞行条件下的计算是在峰值加热轨迹点处或非常接近峰值加热轨迹点的情况下进行的,涉及涉及受损风侧面积反应固化玻璃(RCG)涂层的硅砖的多种损坏情况。在这项研究中,由缺失的瓷砖形成的孔洞相对较短,导致流动特征表明了开孔行为。计算结果表明,相对于风洞条件的预测,为飞行而预测的加热颠簸因子水平升高。用于飞行模拟的空腔底板上的峰值加热颠簸因子(定义为空腔上游的参考值的局部加热)比风洞模拟峰值大67%。在型腔的下游面上,飞行模拟值比风洞模拟值大60%。在型腔下游的外模具线(OML)上,飞行值比风洞模拟值大约20%。在飞行模拟中观察到的较高的加热颠簸因子是由于在飞行模拟中进入腔体的能量具有更大的驱动潜力。这可以通过飞行模拟腔之前通过边界层的总焓的较大增加率来证明。

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