Spice Thermal Subcircuit of Multifinger HBT derived from Ritz Vector reduction technique of 3D Thermal Simulation for electrothermal modeling

摘要

This paper deals with the integration of a reduced thermal model based on tree dimensional Finite Element (FE) thermal simulation into circuit simulator for accurate prediction of electrothermal behavior of power devices. The reduced thermal model based on the Ritz vectors approach is easily usable in any kind of circuit simulator because it is described by a spice format subcircuit. The model has been successfully experimented with the ADS simulator. Electrical based thermal measurements of transient temperature response have successfully validated our approach.