首页> 美国卫生研究院文献>Nanoscale Research Letters >Evaluation of mesoporous silicon thermal conductivity by electrothermal finite element simulation
【2h】

Evaluation of mesoporous silicon thermal conductivity by electrothermal finite element simulation

机译:用电热有限元模拟评估介孔硅的导热系数

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

The aim of this work is to determine the thermal conductivity of mesoporous silicon (PoSi) by fitting the experimental results with simulated ones. The electrothermal response (resistance versus applied current) of differently designed test lines integrated onto PoSi/silicon substrates and the bulk were compared to the simulations. The PoSi thermal conductivity was the single parameter used to fit the experimental results. The obtained thermal conductivity values were compared with those determined from Raman scattering measurements, and a good agreement between both methods was found. This methodology can be used to easily determine the thermal conductivity value for various porous silicon morphologies.
机译:这项工作的目的是通过将实验结果与模拟结果拟合来确定介孔硅(PoSi)的热导率。将集成到PoSi /硅基板和本体上的不同设计测试线的电热响应(电阻与施加的电流)进行了比较。 PoSi热导率是用于拟合实验结果的单个参数。将获得的热导率值与通过拉曼散射测量确定的热导率值进行比较,发现两种方法之间具有良好的一致性。该方法可用于轻松确定各种多孔硅形态的热导率值。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号