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Surface Roughness and Grain Size Characterization of Annealing Temperature Effect For Growth Gallium and Tantalum Doped Ba0.5 Sr0.5TiO3Thin Film

机译:生长镓和钽掺杂BA 0.5 TiO <亚晶膜的表面粗糙度和晶粒尺寸表征退火温度效应的表征。

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摘要

Thin films 10 % gallium oxide doped barium strontium titanate (BGST) and 10 % tantalum oxide doped barium strontium titanate (BTST) were prepared on p-type Si (100) substrates using chemical solution deposition (CSD) method with 1.00 M precursor. The films were deposited by spin coating method with spinning speed at 3000 rpm for 30 seconds. The post deposition annealing of the films were carried out in a furnace at 200oC, 240oC, 280oC (low temperature) for 1 hour in oxygen gas atmosphere. The surface roughness and grain size analysis of the grown thin films are described by atomic force microscope (AFM) method at 5000 nm x 5000 nm area. The rms surface roughness BGST thin films at 5000 nm x 5000 nm area are 0.632 nm, 0.564 nm, 0.487 nm for temperature 200oC, 240oC, 280oC, respectively, whereas the grain size (mean diameter) are 238.4 nm, 219.0 nm, 185.1 nm for temperature 200oC, 240oC, 280oC, respectively. In fact, to increase annealing temperature from 200oC to 280oC would result in decreasing the rms roughness and grain size. Therefore, rms roughness and grain size would have the strong correlation annealing temperature.
机译:薄膜10%的氧化镓掺杂钛酸锶钡(BGST)和10%的氧化钽掺杂的钛酸锶钡(BTST)中使用化学溶液沉积(CSD)方法用1.00M的前体的p型硅(100)衬底上制备。的膜通过旋涂法用在3000rpm下进行30秒旋转速度沉积。膜的沉积后退火是在炉中在200℃,240℃,280℃(低温)1小时在氧气气氛中进行。在5000纳米X 5000纳米区域所生长的薄膜的表面粗糙度和晶粒尺寸分析通过原子力显微镜描述(AFM)方法。均方根在5000纳米X 5000表面粗糙度BGST薄膜纳米面积是0.632纳米,0.564纳米,温度200℃,240℃,280℃,分别0.487纳米,而晶粒尺寸(平均直径)是238.4纳米,219.0纳米,185.1纳米用于温度200℃,240℃,280℃,分别。事实上,为了增加从200℃的退火温度,以280℃将导致降低的均方根粗糙度和晶粒尺寸。因此,RMS粗糙度和晶粒尺寸将具有很强的相关性的退火温度。

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