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Free-standing, thin-film sensors for the trace detection of explosives

机译:用于痕量爆炸物的独立式薄膜传感器

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摘要

Abstract In a world focused on the development of cybersecurity, many densely populated areas and transportation hubs are still susceptible to terrorist attacks via improvised explosive devices (IEDs). These devices frequently employ a combination of peroxide based explosives as well as nitramines, nitrates, and nitroaromatics. Detection of these explosives can be challenging due to varying chemical composition and the extremely low vapor pressures exhibited by some explosive compounds. No electronic trace detection system currently exists that is capable of continuously monitoring both peroxide based explosives and certain nitrogen based explosives, or their precursors, in the vapor phase. Recently, we developed a thermodynamic sensor that can detect a multitude of explosives in the vapor phase at the parts-per-trillion (ppt) level. The sensors rely on the catalytic decomposition of the explosive and specific oxidation–reduction reactions between the energetic molecule and metal oxide catalyst; i.e. the heat effects associated with catalytic decomposition and redox reactions between the decomposition products and catalyst are measured. Improved sensor response and selectivity were achieved by fabricating free-standing, ultrathin film (1 µm thick) microheater sensors for this purpose. The fabrication method used here relies on the interdiffusion mechanics between a copper (Cu) adhesion layer and the palladium (Pd) microheater sensor. A detailed description of the fabrication process to produce a free-standing 1 µm thick sensor is presented.
机译:摘要在一个专注于网络安全的发展中,许多人口稠密的地区和运输中心仍然易于通过简易爆炸装置(IED)恐怖袭击。这些装置经常使用过氧化物基炸药以及硝胺,硝酸盐和硝基甲瘤的组合。由于不同的化学成分和一些爆炸性化合物表现出的极低蒸汽压力,这些炸药的检测可能是挑战性的。目前不存在电子痕量检测系统,其能够在气相中连续地将基于过氧化物的炸药和某些氮基炸药或其前体进行缺失。最近,我们开发了一种热力学传感器,可以在每亿零件(PPT)水平上检测气相中的多种炸药。传感器依赖于能量分子和金属氧化物催化剂之间的爆炸性和特异性氧化还原反应的催化分解;即,测量与分解产物和催化剂之间的催化分解和氧化还原反应相关的热效应。通过为此目的制造独立式的超薄膜(1μm厚)微热器传感器来实现改进的传感器响应和选择性。这里使用的制造方法依赖于铜(Cu)粘附层和钯(Pd)微热器传感器之间的相互扩散力学。制造过程的详细描述,以产生自由站立1微米厚的传感器被呈现。

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