Numerical Modeling of Multi-Conductor Interconnects for High Speed Integrated Circuits

摘要

Presented here is an alternative methodology to the development of transmission line models for multi-conductor interconnects in high speed integrated circuits. The methodology starts with the assumption that per unit length (p.u.l.) transmission line parameters ??? i.e. p.u.l. resistance R, inductance L, capacitance C, and conductance G ??? have been extracted using a two-dimensional RLCG extractor. The methodology relies upon a rational fitting algorithm called VECTFIT to express the parameters as a rational function expression, a form suitable for equivalent circuit generation using a commercial circuit simulator like HSPICE. The methodology has been numerically verified and implemented in the form of some select interconnecting scenarios for typical on-chip applications. The new methodology has also been compared with the previous methodology for robustness, accuracy and computational efficacy.