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Technical Manual: Ultrasonic Quarts Cutting Equipment

机译:技术手册:超声波石英切割设备

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摘要

The quartz crystal industry has been interested in the possibilities of cutting quartz wafers by means of ultrasonic vibrations for nearly ten years.nAS the result of a recent investigation, Raytheon Ultrasonic Quarts Cutting Equipment was designed:n1. To cut 21 quarts wafers simultaneously, close to the rigid orientation specifications required for high-frequency AT crystals.n2. To make possible savings in quartz by the use of thinner and more closely spaced cuts.n3. To cut circular or rectangular dice.n4. To achieve reduction in use of industrial diamonds and bort.

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  • 作者单位
  • 年度 1956
  • 页码 1-106
  • 总页数 106
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工业技术;
  • 关键词

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