Electrodeposition with a Pulsating Current

摘要

The effect of a pulsating current on the morphology of metal deposits obtained by electrodeposition was studied. Improved structure, microhardness, brilliance and regularity of the plate surface were objectives. Theoretical limitation on pulse current depositions are recalled, including current density, diffusion and transport phenomena. An experiment, involving pulse current nickel electroplating, is described. Results show that the optimal pulse frequency lies between 50 Hz and 100 Hz. A reduction in plate thickness is achieved, while physical characteristics of plate obtained with dc are maintained. Industrial application to gold plating is suggested.