Advancement of Reliability, Processing and Automation for Integrated Circuits with the National Bureau of Standards (ARPA/IC/NBS)

摘要

The program described in this report was undertaken in 1973 to develop the measurement technology necessary to enable device manufacturers to exert more effective control over the materials and processes they use to make integrated circuits with the ultimate aim of providing increased reliability at reasonable cost. Work was carried out in 12 technical areas: resistivity and dopant characterization; crystal defects and contaminants; oxides and other insulator films; physical analysis techniques; film and layer thickness; materials for infrared detector arrays; materials and procedures for wafer processing; photolithography; microelectronic test patterns; wafer inspection and test; die and interconnection bonding; and hermeticity.