Associative Memory Circuits and Processing Elements for Intelligent Systems. Phase 1 Final Report

摘要

Novel associative memory circuits and processing elements have been investigated. The objective is to provide content-addressable memories (CAMs) and associative processing elements (APEs) which combine high performance, high density, radiation hardness, and temperature tolerance for advanced adaptive processors. Comprehensive simulations by computer programs and scrutinizing analyses have verified the feasibility of the development of the proposed associative memory circuits and an associative multiplier. The outstanding performance, high density, excellent radiation hardness, and wide temperature tolerance have substantiated that the proposed associative approach can lead to a breakthrough in intelligent processing and computing. The calculations and simulations have been based on parameters of available CMOS processes in order to assure manufacturability. These novel circuits can also be implemented with future submicrometer CMOS, SOS, SOI, or GaAs processes. The resulting novel components will be key elements in knowledge-based robots, controllers, and processors as well as in ultra-high-performance components.