Some Applications of Hybrid Thick Film Technology.

摘要

Hybrid thick film technology from its inception provided a capability that cannot currently be duplicated by any other solid-state active device process. This program explored the utilization of this technology by breadboarding various versions of low-power communications devices. It was established that the technology is capable of producing high yield, reasonable cost equipment of extremely miniature size, high efficiency and low power consumption. The potential applications explored were not all inclusive. The processes used can now be considered reliable, state-of-the-art fabrication techniques. (Author)