Bonding machine for forming a solar array strip

摘要

A machine is described for attaching solar cells to a flexable substrate on which printed circuitry has been deposited. The strip is fed through: (1) a station in which solar cells are elevated into engagement with solder pads for the printed circuitry and thereafter heated by an infrared lamp; (2) a station at which flux and solder residue is removed; (3) a station at which electrical performance of the soldered cells is determined; (4) a station at which an encapsulating resin is deposited on the cells; (5) a station at which the encapsulated solar cells are examined for electrical performance; and (6) a final station at which the resulting array is wound on a takeup drum.