Determining bonding, thickness, and density via thermal wave impedance NDE

摘要

Bonding, density, and thickness of coatings have a vital effect on their performance in many applications. Pioneering development work on thermal wave nondestructive evaluation (NDE) methods during the past 25 years has resulted in an array of useful techniques for performing bonding, density, and thickness measurements in a practical shop environment. The most useful thermal wave methods for this purpose are based on thermal wave surface impedance measurement or scanning. A pulse of heat from either a thermal transducer or a hot gas pulse is projected onto the surface, and the resulting temperature response is analyzed to unfold the bonding, density, and thickness of the coating. An advanced emissivity independent infrared method was applied to detect the temperature response. These methods were recently completely computerized and can automatically provide information on coating quality in near real-time using the proper equipment. Complex shapes such as turbine blades can be scanned. Microscopic inhomogeneities such as microstructural differences and small, normal, isolated voids do not cause problems but are seen as slight differences in the bulk thermal properties. Test objects with rough surfaces can be effectively nondestructively evaluated using proper thermal surface impedance methods. Some of the basic principles involved, as well as metallographic results illustrating the ability of the thermal wave surface impedance method to detect natural nonbonds under a two-layer thermally sprayed coating, will be presented.