Contamination detection NDE for cleaning process inspection

摘要

In the joining of multilayer materials, and in welding, the cleanliness of the joining surface may play a large role in the quality of the resulting bond. No non-intrusive techniques are currently available for the rapid measurement of contamination on large or irregularly shaped structures prior to the joining process. An innovative technique for the measurement of contaminant levels in these structures using laser based imaging is presented. The approach uses an ultraviolet excimer laser to illuminate large and/or irregular surface areas. The UV light induces fluorescence and is scattered from the contaminants. The illuminated area is viewed by an image-intensified CCD (charge coupled device) camera interfaced to a PC-based computer. The camera measures the fluorescence and/or scattering from the contaminants for comparison with established standards. Single shot measurements of contamination levels are possible. Hence, the technique may be used for on-line NDE testing during manufacturing processes.