首页> 外文会议>Annual SEMI Advanced Semiconductor Manufacturing Conference >Surface Contamination Control through Atomically Clean Surface (ACS?) Processing for Semiconductor Equipment Parts for Sub-20 Nanometer Nodes (Topics: CFM, DI, ER, YE)
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Surface Contamination Control through Atomically Clean Surface (ACS?) Processing for Semiconductor Equipment Parts for Sub-20 Nanometer Nodes (Topics: CFM, DI, ER, YE)

机译:通过原子清洁表面(ACSα)处理Sub-20纳米节点的半导体设备部件的表面污染控制(主题:CFM,DI,ER,YE)

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Meeting defectivity requirements are challenging as technology nodes continue to scale down. Defect variability such as particles and residues create killer defects at the component-level and is expected to severely impact product yields at sub-20 nanometer technology nodes. Additional complexity, in the form of new processes and materials, will further challenge component-level design and performance. One approach towards Contamination Control Processing (CCP) focuses on component-level refurbishment. Quantum Global Technologies? (QGT: Quantum Clean? & ChemTrace?), a leader in the semiconductor parts cleaning and analytical business through their Atomically Clean Surface (ACS?) process, has developed new technologies aimed at exceeding OEM performance and meeting stringent defectivity requirements for sub-20 nanometer technologies. This is achieved by highly optimized parts cleaning and coating processes. This paper outlines recent advances in the ACS? parts cleaning process by focusing on particle removal methods. This work addresses some of the major challenges and solutions towards achieving contamination-free manufacturing (CFM) in a cost-effective manner. The present work will present real examples of improved customer productivity due to part life extension and maintaining lower defects through ACS? specialized cleaning. The paper will also present solutions and tips including coatings with superior adhesion properties and physical characteristics used to enhance chamber performance in PVD and Etch process areas to address defectivity issues at sub-20 nanometer technology nodes. In addition, the present work discusses the application of modeling through computer-aided simulation as method to reduce the cost of repetitive testing and provide accurate predictions of part recycle lifetime. Solutions provided by QuantumClean? also help to substantially increase the number of recycle cleans possible before refurbishment is necessary.
机译:由于技术节点继续缩小,满足缺陷要求挑战。缺陷变异性,例如颗粒和残留物在组件级产生杀手缺陷,并且预计将在亚20纳米技术节点处严重影响产品产量。以新的流程和材料的形式提供额外的复杂性,将进一步挑战组件级设计和性能。一种污染控制处理(CCP)的一种方法侧重于组分级翻新。量子全球技术? (QGT:量子清洁?&Chemtrace?),通过原子清洁表面(ACSα)流程的半导体部件清洁和分析业务的领导者,开发了新技术,旨在超过OEM性能并满足SUB-20的严格缺陷要求纳米技术。这是通过高度优化的零件清洁和涂覆工艺来实现的。本文概述了ACS的最近进步?零件清洁过程通过专注于颗粒去除方法。这项工作解决了一些主要挑战和解决方案,以实现无效的方式实现无污染制造(CFM)。目前的作品将提高客户生产率的实际例子,由于零件生命延伸,并通过AC维持较低的缺陷?专业清洁。本文还将提供解决方案和提示,包括具有卓越的粘附性和物理特性的涂层,用于增强PVD和蚀刻工艺区域的腔室性能,以解决Sub-20纳米技术节点的缺陷问题。此外,本作探讨了通过计算机辅助模拟建模的应用作为降低重复测试成本的方法,并提供对零件再循环寿命的准确预测。由量子杂志提供的解决方案?在需要之前,还有助于大大增加回收的循环次数。

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