Failure Analysis of CCD Image Sensors Using SQUID and GMR Magnetic Current Imaging

摘要

During electrical testing of a Full Field CCD Image Senor, electrical shorts were detected on three of six devices. These failures occurred after the parts were soldered to the PCB. Failure analysis was performed to determine the cause and locations of these failures on the devices. After removing the fiber optic faceplate, optical inspection was performed on the CCDs to understand the design and package layout. Optical inspection revealed that the device had a light shield ringing the CCD array. This structure complicated the failure analysis. Alternate methods of analysis were considered, including liquid crystal, light and thermal emission, LT/A, TT/A SQUID, and MP. Of these, SQUID and MP techniques were pursued for further analysis. Also magnetoresistive current imaging technology is discussed and compared to SQUID.