Soldering of Thin Film-Metallized Glass Substrates

摘要

The ability to produce reliable electrical and structural interconnections211u001ebetween glass and metals by soldering was investigated. Soldering generally 211u001erequires premetallization of the glass. As a solderable surface finish over soda-211u001elime-silicate glass, two thin films coatings, Cr-Pd-Au and NiCr-Sn, were 211u001eevaluated. Solder nettability and joint strengths were determined. Test samples 211u001ewere processed with Sn60-Pb40 solder alloy at a reflow temperature of 210 C. 211u001eGlass-to-cold rolled steel single lap samples yielded an average shear strength 211u001eof 12 MPa. Solder fill was good. Control of the Au thickness was critical in 211u001eminimizing the formation of AuSn(sub 4) intermetallic in the joint, with a 211u001eresulting joint shear strength of 15 MPa. Similar glass-to-glass specimens with 211u001ethe Cr-Pd-Au finish failed at 16.5 MPa. The NiCr-Sn thin film gave even higher 211u001eshear strengths of 20-22.5 MPa, with failures primarily in the glass.