首页> 美国政府科技报告 >Smart sensor technology for joint test assembly flights.
【24h】

Smart sensor technology for joint test assembly flights.

机译:用于联合测试组装飞行的智能传感器技术

获取原文

摘要

The world relies on sensors to perform a variety of tasks from the mundane to sophisticated. Currently, processors associated with these sensors are sufficient only to handle rudimentary logic tasks. Though multiple sensors are often present in such devices, there is insufficient processing power for situational understanding. Until recently, no processors that met the electrical power constraints for embedded systems were powerful enough to perform sophisticated computations. Sandia performs many expensive tests using sensor arrays. Improving the efficacy, reliability and information content resulting from these sensor arrays is of critical importance. With the advent of powerful commodity processors for embedded use, a new opportunity to do just that has presented itself. This report describes work completed under Laboratory-Directed Research and Development (LDRD) Project 26514, Task 1. The goal of the project was to demonstrate the feasibility of using embedded processors to increase the amount of useable information derived from sensor arrays while improving the believability of the data. The focus was on a system of importance to Sandia: Joint Test Assemblies for ICBM warheads. Topics discussed include: (1) two electromechanical systems to provide data, (2) sensors used to monitor those systems, (3) the processors that provide decision-making capability and data manipulation, (4) the use of artificial intelligence and other decision-making software, and (5) a computer model for the training of artificial intelligence software.

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号