Plasma Surface Modification of Polymer Backsheets: Origins of Future Interfacial Barrier/Backsheet Failure

摘要

Flexible polymer substrates coated with inorganic oxide moisture barriers are a potential replacement for glass backsheets in thin film PV modules. Silicon oxynitride (SiOxNy) deposited by PECVD on polyethylene terephthalate (PET) represents one potential new backsheet candidate. Barrier deposition runs at NREL have typically included a nitrogen-rich plasma pretreatment prior to actual barrier deposition with the intention of cleaning the PET surface as well as enhancing adhesion of the SiOxNy barrier film to PET; however, test coupons of PET/barrier/EVA/TPE failed after damp heat exposure. PET substrates exposed to plasma conditions similar to those used in pre-treatment were examined by X-ray photoelectron spectroscopy (XPS) to reveal new low molecular weight PET fragments are created which are volatile upon heating and water soluble. Failure analysis of the coupons determined that the moisture barrier is, in fact, transferred to the encapsulant side.