Dislocations Near the Interface of Electrodeposited Copper and Nickel Single Crystals

摘要

A new technique, based on transmission electron microscopy, has been used to study defects at and near the interfaces of epitaxial electrodeposits on copper and nickel single crystals. Thick (greater than 100 mu m) single crystal epitaxial deposits of copper were made on (100), (111) and (123) surfaces of copper crystals using a sulphate bath, and of nickel on (100) surfaces of nickel crystals using the Watts plating bath. The electrodeposited specimens were sectioned normal to the interface and the areas near the interface were thinned for study by electron microscopy. (ERA citation 04:006239)