Microstructure Development and Interface Studies in Thick Film Conductor Systems

摘要

A new thick film conductor system which used acid treated (.01N HCl) lead borosilicate glass particles with chemically coated metal (silver) film was developed. Using only 40 wt% metal (silver), sheet resistivities as low as 45 milliohms/sq were obtained in this system. Detailed study of the microstructure development was done. Effect of the acid treatment of the glass particles prior to the metal coating was analyzed. X-ray photoelectron spectra studies showed preferential leaching of lead and boron from the surface of the glass. Good bonding between silver film and the glass was attributed to the oxidation of silver (to form Ag exp + ) in the presence of oxygen and H exp + ions on the glass surface (from acid treatment) and subsequent diffusion of Ag exp + into the glass to form a continuous chemical interface. A model to predict sheet resistivities of the new thick film conductors was developed. (ERA citation 05:020921)