LSA Large Area Silicon Sheet Task Enhanced I.D. Slicing. Quarterly Report No. 5, January-March 1980

摘要

This program is intended to develop and demonstrate enhanced I.D. slicing technology that will significantly increase the number of usable slices per inch of ingot over industry practice. This process requires a reduction in both blade and slice thickness and will be achieved through a combination of three key elements of slicing technology: ingot rotation with minimum exposed blade area, dynamic cutting edge control, and the use of prefabricated insert blades. Tests continued this quarter as dictated by the Program Plan. In all demonstrations, the ingots were rotated with the ultimate goal of keeping kerf loss at a minimum (between 130 to 180 microns) while achieving slice thickness of less than 250 microns. In almost all cases, ingots were 100 mm in diameter. Typical feed rates averaged 14 mm per minute. It was demonstrated that blade deflection can be effectively controlled through the use of the cutting edge position control system. This system has significantly increased wafer productivity. A blade dressing device was developed and installed thus obtaining truing precision superior to that of the hand-held dressing stick. (ERA citation 05:027084)