Plasma Cleaning, End-of-Process Detection

摘要

Activated gas plasma is being used extensively to remove trace organic contamination from electromechanical components prior to final assembly. Optical emission techniques are being used throughout the electronics industry to determine end-points of plasma processes for removing large amounts of photo-resist. The application of these techniques to detect the removal of trace organic residues was shown to be possible using a borrowed process monitor. Removal of organic contamination as low as 5 mg total was detected in an oxygen plasma. Auger analysis confirmed the cleanliness levels indicated by the end-point detector tested. The simplicity of this type of process monitor lends itself to production line use for the plasma cleaning of various parts and batch sizes. The monitoring of argon plasma cleaning processes using optical emission techniques has also been investigated. (ERA citation 05:026149)