PLASMA CLEANING RING FOR IN-SITU CLEANING, PLASMA PROCESSING APPARATUS INCLUDING A PLASMA RING, PLASMA PROCESSING SYSTEM INCLUDING THE PLASMA CLEANING RING AND PLASMA PROCESSING METHOD USING THE PLASMA CLEANING RING

摘要

The substrate can be selectively transferred by a vacuum or edge grip method according to the process characteristics, using a single substrate transfer robot equipped in the front end module. Additionally, after the process, the substrate can be loaded using the buffer chamber, for the cooling process and transfer of the substrate.