Metastable pitting corrosion of aluminum, Al-Cu, and Al-Si thin films in dilute HF solutions and its relevancy to the processing of integrated circuit interconnections.

摘要

We have investigated the pitting corrosion of Al, Al-Cu, and Al-Si thin films in dilute hydrofluoric acid solution. Additions of Cu and, to a lesser extent, Si cause an increase in open circuit potentials (OCP), pit densities and pit sizes as compared to ...