Reduced order models for thermal analysis : final report : LDRD Project No. 137807

摘要

This LDRD Senior's Council Project is focused on the development, implementation and evaluation of Reduced Order Models (ROM) for application in the thermal analysis of complex engineering problems. Two basic approaches to developing a ROM for combined thermal conduction and enclosure radiation problems are considered. As a prerequisite to a ROM a fully coupled solution method for conduction/radiation models is required; a parallel implementation is explored for this class of problems. High-fidelity models of large, complex systems are now used routinely to verify design and performance. However, there are applications where the high-fidelity model is too large to be used repetitively in a design mode. One such application is the design of a control system that oversees the functioning of the complex, high-fidelity model. Examples include control systems for manufacturing processes such as brazing and annealing furnaces as well as control systems for the thermal management of optical systems. A reduced order model (ROM) seeks to reduce the number of degrees of freedom needed to represent the overall behavior of the large system without a significant loss in accuracy. The reduction in the number of degrees of freedom of the ROM leads to immediate increases in computational efficiency and allows many design parameters and perturbations to be quickly and effectively evaluated. Reduced order models are routinely used in solid mechanics where techniques such as modal analysis have reached a high state of refinement. Similar techniques have recently been applied in standard thermal conduction problems e.g. though the general use of ROM for heat transfer is not yet widespread. One major difficulty with the development of ROM for general thermal analysis is the need to include the very nonlinear effects of enclosure radiation in many applications.