A thermal analysis apparatus calculates an area of a predetermined range including an electronic component mounted on a printed-circuit board. The thermal analysis apparatus counts the number of via holes included in the predetermined range of which the area is calculated. The thermal analysis apparatus calculates a first physical property value using the area calculated, the number of via holes counted, and a preset physical property value of a conductor. The thermal analysis apparatus generates a thermal analysis model subject to thermal analysis in which a preset physical property value is set in the electronic component and a heat release path having the first physical property value calculated is provided in the printed-circuit board so as to extend from the electronic component in a layer direction of the printed-circuit board.
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