Folded Interconnection Network Development

摘要

The objective of the Folded Interconnection Network Development (FIND) programwas to combine the rapidly emerging vertical cavity' surface emitting laser (VCSEL) based smart pixel technology with a new free-space optical interconnection (FSOI) architecture which maximally exploits the ability of three dimensional free space optics to overcome the interconnection bottlenecks of multiprocessor systems. To focus the research, ultrahigh throughput (-Tbit/sec) packet switching was selected as the key application area. The, FIND program analytical results included a comparison of FSOI-based approaches with the traditional chip-multi-chip-module/printed circuit board metallic interconnection hierarchy. This analysis yielded fundamental scaling laws based on the geometrical constraints associated with implementing high bisection bandwidth networks. The results proved that FSOI provides orders of magnitude advantage in size, weight, and power consumption for multiprocessor networks with bisection bandwidths greater than about 1 Tbit/sec. The experimental portions of the FIND program focused on the optomechanical issues related to the MCM based retroreflective architecture. A one lens per chip design philosophy was adopted. Key optical elements of the package were evaluated with one dimensional and two dimensional arrays of VCSELs. An optical interconnection module was then designed and fabricated. The module achieved 10 micron resolution and registration accuracy across an entire 10 X 10 cm multichip substrate.