Fluoroaliphatic Cyanate Resins for Low Dielectric Applications

摘要

The present invention is a cyanate resin monomer having the formula: NCO-CH2-(CF2)n-CH2-OCN where n is an even integer from 6 to 10, inclusive. Another aspect of the invention is an essentially pure cyanate resin monomer having the formula: NCO-CH2-(CF2)n-CH2-OCN where n = 3, 4, 6, 8, or 10. Another aspect of the invention is a prepolymer made by the process of heating a monomer of the invention to a conversion below the gel point. Another aspect of the invention is a method for depositing an interlevel dielectric resin on an integrated circuit, having the steps: (a) coating the integrated circuit with a thin film of a prepolymer made by the process of heating a monomer of the invention to below the gel point, and (b) curing the prepolymer to at least the gel point. Another aspect of the invention is a low dielectric thermoset polymer resin made from these monomers. Another aspect of the invention is a composite of a resin of the invention combined with another material or materials, for structural and/or electronic applications. Such materials include powders and fibers made from, e.g., fused silica or quartz. Another aspect of the invention is making and purifying the monomers of the invention.