Processing of Interconnected Glass and Ceramic Composites for ElectronicPackaging

摘要

Glasses and glass-ceramics are well known for their low dielectric constant(epsilon approx. 3-5) at 1MHz which make them useful substrate materials for high speed electronic packaging. On the other hand, crystalline ceramics such as AlN have moderate dielectric constants (epsilon approx. 9-12) at 1MHz high thermal conductivity useful for high power packages. Porous and glass infiltrated ceramic composites with interconnected high thermal conductivity phases therefore, have the potential of possessing optimum dielectric constant (approx. 5) and thermal conductivity (approx.20-60 W/m-K) for substrate applications. This report discusses the results of the work conducted in processing interconnected porous