Dense 3D Integrated Electronic/Photonic Computing Structures Enabled byDiffractive Optical Elements

摘要

Substantial progress is reported on the development of a novel photonic multi-chip module technology, and on the passive optical components that provide parallel chip to chip interconnections within the module. This progress includes extensive characterization of a compact optical power bus to distribute an optical array of readout beams to a set of modulators; novel design and algorithm development, successful fabrication, and characterization of diffractive optical elements (DOE's) for use in ultra-compact, short length and propagation interconnection systems; the analysis of photonic multi-chip module design and performance parameters; and the preliminary investigation of applications for such multi-chip modules. Directly related work on flip chip bonding between silicon (detection and signal processing) chips and GaAs-based (modulator array and VCSEL array) chips, and on the design and test of FET-SEED spatial light modulator array chips has also been accomplished. Different operational wavelengths and module design variations potentially allow either of these smart pixel spatial light modulator approaches to be used for the optical input/output functions within the photonic multi-chip module.