Massively Parallel Post-Packaging for Microelectromechanical Systems (MEMS)

摘要

This project has achieved many accomplishments toward 'Massively Parallel Post-Packaging for MEMS.' These achievements can be summarized as follows: (1) innovative bonding processes; (2) post-fabrication packaging demonstrations and characterizations on various MEMS devices; and (3) demonstrations and characterizations of post-fabrication device trimming. In summary, we were able to develop several new localized bonding processes, including eutectic bonding, fusion bonding, solder bonding, chemical vapor deposition (CVD) bonding, nano-second laser welding, inductive heating and bonding, ultrasonic bonding and rapid thermal processing (RTP) bonding. Every bonding process represents technology innovation and advancement. In addition, new material bonding systems were also investigated and established. These include aluminum-to-glass, aluminum-to-nitride, and aluminum-to-aluminum bonding systems. The new bonding processes and systems make possible the device encapsulation demonstrations, such as vacuum encapsulated micro resonators, by using localized aluminum-to-glass bonding, RTP bonding and localized CVD bonding. These vacuum bonded devices have gone through various types of characterization, including quality factor measurements, long-term stability monitoring and accelerated tests. In another device packaging area, selective trimming of micro resonators was successfully demonstrated by three different schemes, including active trimming by a localized heating and stressing effect, permanent trimming by localized CVD deposition and by pulsed laser deposition.