Application-Specific Integrated-Microelectromechanical Systems (MEMS) Process Services (ASIMPS)

摘要

The primary goal of this project was to develop the technology for an application-specific integrated microelectromechanical systems (MEMS) process service, called ASIMPS. Multiple government, industry and academic institutions participated in seven integrated MEMS process runs. Layout rules, design practices and tutorials for integrated MEMS were generated. Microelectromechanical structures were made from the interconnect layers within commercial foundry integrated circuit processes. The post-foundry micromachining process comprised dry etching of the dielectric layers, then a deep-reactive-ion etch of silicon followed by an isotropic silicon undercut to release the structures. An alternate fabrication flow was explored that created single-crystal silicon structures within the foundry processes. Microdevices included accelerometers, gyroscopes, vibratory magnetometers, microphones, microspeakers, scanning mirrors, high quality factor inductors, and tunable capacitors. In particular, microaccelerometers were developed with resolution limited by brownian noise. Millimeter-sized mirrors in the single-crystal silicon process were developed for laser scanning applications. Microspeakers and microphone designs that exploit a unique mesh membrane sealed with polymer were successfully transferred to industry.