RF Communication Subsystem Integration Research

摘要

The feasibility of integrating RF communication subsystems into system-on-a-chip devices to form covert sensor networks was investigated. The research vision and vehicle was an M&M(trademark) candy-sized, low power, affordable (a few dollars) CMOS micronode device. The goals were to investigate approaches for realization of small on-chip antenna, define circuity and techniques for wireless activation of a micronode device before deployment, and define low power circuitry for key functional blocks within the micronode. The antenna research concluded that on-chip antennas at approx. 5 GHz were easily realizable, but additional investigations were needed to establish more optimal on-chip 2.4 GHz antennas. Integrated low power designs were devised and verified for a transceiver and for wireless activation. Communication ranges that were feasible when limiting the available power source to 10's of mAh were 20 m node to node and 1 km node to base station. Device power dissipation, available power/energy and desired physical size and operating life place tight constraints on the design. The battery dimensions determine the size of the assembly. The micronode assembly will consist of only a small battery and one chip in a sealed rugged unit.