Production Engineering Measure. Reliability Through Process Improvement (Estension to 2n2525 Transistor Family)

摘要

Two methods of final package closure have been investigated during this quarter. They were stitch welding and cold welding. Stitch welding proved too slow to be of practical use resulting in work being concentrated on cold welding. With proper design of the cold welding dies a high yield and practical production rate can be obtained. Detailed drawings of improved ceramic package design were make and sample lots ordered. Feed-through pin seals were optimized to give a 95-100% yield of hermetic seals. (Author)