Proceedings of the Conference on Reliability of Semiconductor Devices and Integrated Circuits, Volume II, 17, 18 and 19 June 1964, New York, N. y

摘要

Contents: Elimination of gross particles; A closure welder for nontubulated semiconductors; Development and application of hot hydrogen mounting furnace; Development and application of accelerated temperature testing; Analytical empirical surface studies; The chemistry and physics of semiconductor reliability; Reliability improvement of germanium electrochemical transistors; Statistical analysis of electronic parts reliability test data; Reliability improvement of electrochemical transistors; Step stress test for high power transistors; Life testing methods employed to demonstrate reliability improvement; Establishment of optimum diffusion control; Uniform metal evaporation; Small ball bonding; Process surveillance a tool for improving in-process quality conformance.