On the Connection Between Thermal Conductivity and Dislocation Mobility at Low Temperatures

摘要

The low temperature dragging force on moving dislocations on account of phonon scattering is calculated with the help of phonon relaxation times which are available from the theory of thermal conductivity. It is assumed that the dislocations move uniformly with a velocity that is much smaller than sound velocity. Numerical values for the friction coefficient are obtained for straight edge and screw dislocations with the material constants of copper. The results are compared with the corresponding data for the case of moving kinks. (Author)