SPECIAL DEVICES, TEST STRUCTURES, AND HYBRID CIRCUITS FOR SPECIAL ENVIRONMENTS

摘要

This final report summarizes the work completed under Contract No. DAAG39-73-C-0003 and its subsequent modifications It describes eight special semiconductor devices or test structures plus an interconnection method developed for interconnecting multiple chip hybrid circuits. Non-gold, compatible material structures and fabrication techniques are used in making these special devices.nOnly materials and fabrication techniques are covered in this report. Performance data and environmental test data will be the subject of future HDL reports.