Report on Modular Avionic Packaging (MAP) Industry Briefing and Response.

摘要

This report provides information related to a modular avionic packaging (MAP) concept presented to industry on 9 May 1978 at the Naval Avionics Center, Indianapolis, Indiana. In attendance at this meeting were 78 representatives of different divisions of 33 companies. As major suppliers of avionics to the Navy, comments provided by these companies were anticipated to be very useful in the further development of packaging approaches for future avionics. This report contains the responses provided by industry. Although the companies responding are identified by name for reference, a reasonable attempt has been made to render the comments anonymous by removing company names and product references. The comments have been grouped into categories and summarized; however, no attempt has been made in this report to resolve areas of conflicting opinion given by different companies. It is not intended to imply that the Navy or this Center endorses, agrees, or disagrees in any manner with the comments provided by industry. (Author)