Stress Relaxation of High-Copper Amalgam Alloys,

摘要

Stress relaxation of seven high-copper dental amalgam alloys was studied over the temperature range of 0 to 55C. At each test temperature the alloy containing the most copper (30 percent) exhibited the lowest rate and lowest magnitude of stress loss. Stress losses and relaxation rates of all materials increased with temperature. However, patterns of stress decay could be correlated with neither the compositional nor the structural characteristics of the individual alloys. Stress relaxation behavior may be an indicator of the relative performance capabilities of high-copper amalgams. (Author)