This handbook is concerned with the use of epoxies, polyurethanes, and silicones as insulating embedding agents for electrical and electronic components. These three families of resins are the materials which currently find the widest use in high performance component protection. Another material, the polyxylylenes, which are vacuum deposited on substrates as very thin dielectrics, is also discussed. The processes of embedding which are discussed include encapsulation, potting, casting, conformal coating, surface coating, impregnation, and transfer molding.
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