MM and T for VHSIC Multichip Packages.

摘要

The objective of the LABCOM Multichip Packaging program was to develop hermetic ceramic packages suitable for interconnection of up to nine VHSIC chips operating at 100 MHz clock rates. Two packages have been designed and fabricated. One design (196 I/O) accommodated 2-4 VHSIC devices, while the other (308 I/O) accommodated 5-9 VHSIC devices. A populated 196 I/O quad SRAM module has been delivered and also five (5) each unpopulated 196 and 308 I/O packages. All electrical testing, data fixtures, methods, etc, relative to the packages and module have been delivered per Phase I contractual requirements. The program was divided into three phases. Phase I, originally scheduled to complete Sept. '87, was put on an accelerated schedule and completed December 31, 1986. It included design and fabrication of both package types in prototype quantities, selection of appropriate interconnect schemes, and full electrical evaluation of a populated four chip module. Also included was a survey of VHSIC community packaging requirements and development of domestic sources for package production. Phase III was scheduled to complete the project with a demonstration of limited production capability. (RRH)