首页> 美国政府科技报告 >Substrate Temperature Measurements Using Ultrasonically Bonded Platinel II Thermocouples. (Reannouncement with New Availability Information).
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Substrate Temperature Measurements Using Ultrasonically Bonded Platinel II Thermocouples. (Reannouncement with New Availability Information).

机译:使用超声波粘合的platinel II热电偶进行基板温度测量。 (重新公布新的可用性信息)。

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摘要

The accurate measurement of substrate temperature is important for thin-film deposition processes. In this paper, we report a simple and reproducible method to bond thermocouples directly to a substrate, thus circumventing many difficulties of other temperature measurement techniques. We have ultrasonically bonded 25-pm-diam wires of two different Au-Pt-Pd alloys (14%-31%-55% and 65%-O%-35%), commercially known as Platinel II, to gold bonding pads evaporated onto several surfaces: stainless steel, LaAl03, A203, and YBa2Cu3O7 (YBCO) thin films. The ultrasonic bonding process does not change the thermal emf of the thermocouple from the bulk value, and the resultant bond is able to withstand temperature cycling from room temperature to at least 800 deg C without detachment of the thermocouple from the surface or change in its thermal emf. We have used these thermocouples to measure the surface temperature of a LaAIO3 substrate and a 2000-A YBCO film on a LaA103 substrate in order to evaluate the effectiveness of silver paste as a thermal contact to anchor substrates to a heater block during the sputter deposition of YBCO thin films. Silver paste is found to provide an excellent contact. At a heater temperature of 750 deg C, the temperature difference between the surface of the LaA03 SUbstrate and the surface of the heater was 348 deg C without silver paste and only 2 deg C with silver paste. substrate temperature measurements, thin-film, thermocouples.

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