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Ultrasound NDE of Adhesive Bond Integrity: A Quantitative Measure

机译:粘接剂完整性的超声NDE:定量测量

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The objective of this research was to investigate and develop a coupled approach(analytical, numerical and experimental) to the ultrasonic nondestructive evaluation of adhesive bond integrity. Results of these studies were directed toward nondestructive evaluation (NDE) of the integrity of adhesive bonds and bondlines for advanced composites and multi-layered materials by the U.S. Army. Such studies are needed in both the manufacturing phases of products in order to assure quality as well as during the operating lifetime of the products in order to predict water infiltration or bond deterioration and hence prevent failure. The developed multiple-staged model started from a mathematical description of the ultrasound propagation through an inhomogeneous, isotropic or anisotropic solid with appropriate boundary conditions for the transmitter/receiver coupled to the material under test. Analytical solutions were employed to initially test and calibrate the numerical formulations was configured to be flexible and realistic enough to investigate a wide variety of bond configurations on the computer.

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