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Excimer Laser Processing of Backside-Illuminated CCDS. (Reannouncement with NewAvailability Information)

机译:准分子激光加工背面照明CCDs。 (重新公布新的可用性信息)

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An excimer laser is used to activate previously implanted dopants on the backsideof a backside-illuminated CCD. The controlled ion implantation of the backside and subsequent thin layer heating and recrystallization by the short wavelength pulsed excimer laser simultaneously activates the dopant and anneals out implant damage. This improves the dark current response, repairs defective pixels and improves spectral response. This process heats a very thin layer of the material to high temperatures on a nanosecond time scale while the bulk of the delicate CCD substrate remains at low temperature. Excimer laser processing of backside-illuminated CCDs enables salvage and utilization of otherwise nonfunctional components by bringing their dark current response to within an acceptable range. This process is particularly useful for solid state imaging detectors used in commercial, scientific and government applications requiring a wide spectral response and low light level detection.

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