Focused-Ion-Beam Material Removal Rates.

摘要

Focused-ion-beam milling is a tool used in failure analysis and production of integrated circuits. This technique uses a focused gallium beam to mill away materials on a surface. Each material mills at a different rate, which must be experimentally determined. The data presented here for several materials used in standard integrated circuit processes will allow the user to determine the dose level needed to mill a certain amount of a given material. Focused ion beam, Material removal rates.