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首页> 外文期刊>Physica, E. Low-dimensional systems & nanostructures >Thermo- and galvanomagnetic technique for semiconductors testing at high pressure up to 30 GPa
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Thermo- and galvanomagnetic technique for semiconductors testing at high pressure up to 30 GPa

机译:热和电磁技术,用于在高达30 GPa的高压下进行半导体测试

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The thermoelectric power (S), magnetoresistance (MR) and thermomagnetic (TM) effects were measured at high pressure (P) in the vicinity of semiconductor-metal phase transitions for Te, Se and S micro-samples. From longitudinal and transverse Nernst-Ettingshausen (N-E) effects for Te and Se, the scattering parameter (r) of holes was estimated and under the closing of semiconductor gap (E-g) the decreasing of their effective mass (m) was found. S of Sulphur also decreased with pressure up to 40 GPa and the negative MR effect observed indicates low mobility (mu) of holes. The technique developed seems to be suitable for use in micro-device technology. (C) 2002 Elsevier Science B.V. All rights reserved. [References: 12]
机译:在Te,Se和S微型样品的半导体-金属相变附近,在高压(P)下测量了热电势(S),磁阻(MR)和热磁(TM)效应。从N和E对Te和Se的纵向和横向Nernst-Ettingshausen(N-E)效应,可以估算出空穴的散射参数(r),并在半导体间隙(E-g)关闭时发现其有效质量(m)减小。最高40 GPa的压力下,硫的S值也会降低,并且观察到的MR负面影响表明孔的迁移率(μ)低。开发的技术似乎适用于微设备技术。 (C)2002 Elsevier Science B.V.保留所有权利。 [参考:12]

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