Effects of resistors and capacitors inserted between wires and chip bonding pads on current-voltage characteristics of series junction arrays

摘要

Series Nb/AlOx/Nb junction array circuits are commonly used for evaluation of a critical current (I-c) spread as an important parameter on Nb-based LSI chips. We present a junction array circuit suitable for accurate evaluation of the spread. The circuit has a tolerance for the I-c suppression caused by external noises and synchronous switching which are often observed in measurements. Key elements of the circuit are the low value resistors, large value capacitors, and high value resistors inserted between wires and chip bonding pads. This paper describes effects of these key elements on current-voltage characteristics of junction arrays. (c) 2005 Elsevier B.V. All rights reserved.