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Transmission electron microscopy studies of dislocations in physical-vapour-transport-grown silicon carbide

机译:透射电子显微镜研究物理气相传输生长的碳化硅中的位错

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Micropipes (the hollow cores of axial superscrew dislocations with Burgers vectors that are multiples of a crystal's c lattice parameter) in hexagonal silicon carbide (SiC) semiconductor wafers were observed by transmission electron microscopy (TEM) in both plan-view and longitudinal geometries. Micropipes were seen to be facetted along primary and secondary prismatic faces of the crystal. This hexagonal facetting occurred over a full range of Burgers vector magnitude. The hexagonal cross-sections of the larger micropipes were elongated into slot shapes. Members of closely spaced groups of micropipes had cross-sectional shapes distorted by the strain fields of their neighbours. As the sample was tilted, Bragg contours resulting from the extensive strain fields of the superscrew dislocations swirled around the micropipes. At a two-beam condition in a plan-view sample, twin loops of bright and dark contrast centred on a micropipe were explained to be similar in nature to the twin lobes of bright and dark contrast characteristic of elementary screw dislocations with line directions perpendicular to the surface of a thin foil. Other dislocations with both line directions and Burgers vectors confined to the basal plane of hexagonal SiC semiconductor wafers were observed by TEM, frequently in the immediate environs of micropipes or occasionally in the bulk of the crystal. These dislocations were most often pairs of partials separated by narrow ribbons of stacking fault, although perfect dislocations were sometimes observed that split into the partials at points along their lengths. Observations on the TEM scale were related to those of similar basal plane dislocations seen in X-ray topographs. Because the dislocations terminated at micropipes' surfaces, and sometimes extensive networks of them looped outwards from the micropipes, it was suggested that the micropipes were involved in the generation of basal plane dislocations, acting as stress concentrators for basal plane slip during crystal growth. [References: 31]
机译:通过透射电子显微镜(TEM)在平面图和纵向几何图中观察到六角形碳化硅(SiC)半导体晶片中的微管(轴向超螺旋位错的空心核,其Burgers向量是晶体的c晶格参数的倍数)。观察到微管沿着晶体的主棱柱和次棱柱面刻面。六角形小平面在整个Burgers矢量幅度范围内发生。较大的微管的六角形横截面被拉长成槽形。间距很小的微管组的成员的横截面形状因其邻居的应变场而变形。当样品倾斜时,由超螺旋位错的广泛应变场产生的布拉格轮廓在微管周围旋转。在平面图样本中的两束条件下,以微管为中心的明暗对比的双环被解释为与基本螺丝钉位错的明暗对比的双瓣本质上相似,线方向垂直于薄箔的表面。透射电镜观察到的其他位错均位于六角形SiC半导体晶片的基面上,且线方向和Burgers矢量均位于微管的附近或偶而在晶体的大部分中。这些位错最常是成对的成对的局部,由叠层断层的窄带分隔开,尽管有时观察到完美的位错在沿其长度的点处分裂成局部。 TEM尺度的观察结果与X射线地形图中类似的基底平面错位相关。由于位错终止于微管的表面,并且有时它们的广泛网络从微管向外循环,因此表明微管参与了基面位错的产生,在晶体生长过程中充当了基面滑移的应力集中器。 [参考:31]

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