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Current-induced defect conductivity in hydrogenated silicon-rich amorphous silicon nitride

机译:氢化富硅非晶氮化硅中电流诱导的缺陷电导率

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In general, current transport through thin-film metal-semiconductor-metal diodes containing hydrogenated silicon-rich amorphous silicon nitride (a-SiN.c:H) is determined by electron tunnelling through the potential barriers at the metal-semiconductor contacts. After prolonged current stressing, however, there is a change in the transport mechanism and a large increase in the current. It is shown that the excess current flow is well described by field-enhanced emission of carriers via charged defect states throughout the bulk of the silicon nitride. The effect of the electric field and dependence on defect concentration is consistent with the transport of holes in the vicinity of the valence band tail. As stressing proceeds, more defect states are introduced and the conductivity of the a-SiNx: H increases.
机译:通常,通过电子隧道穿过金属-半导体触点处的势垒来确定通过包含氢化的富硅非晶氮化硅(a-SiN.c:H)的薄膜金属-半导体-金属二极管的电流传输。然而,在长时间施加电流应力后,传输机制发生了变化,电流大幅增加。结果表明,过量的电流通过在整个氮化硅中通过带电缺陷状态的载流子的场增强发射得到了很好的描述。电场的影响以及对缺陷浓度的依赖性与价带尾部附近空穴的传输一致。随着应力的进行,引入了更多的缺陷状态,并且a-SiNx:H的电导率增加。

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